Digital Engineering Conference 2024

April 29* – May 1, 2024

Idaho National Laboratory, 775 MK Simpson Blvd, Idaho Falls, ID

*Optional workshop, DICE Conference begins April 30th. See agenda for more information.

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Back by popular demand!

Join us for the second in-person, national-laboratory led Digital Engineering conference, which will feature guest speakers from across the digital industry and provide an opportunity to foster collaborations that will enhance our nation’s digital future with discussions on:

  • Digital Twins
  • Model-Based Systems Engineering
  • Artificial Intelligence
  • Digital Thread and Computing
  • Instrumentation, Control, and Cyber Resilience
  • Decision Science and Visualization
  • Model-Based Definition (CAD)


Current keynote speakers include Daniel HettemaCandice LingHarlan Bowers, and Geri Richmond.

In person registration is now closed, but you can still attend virtually. Please fill out the registration form and we will email you the links to the main event and breakout sessions by close of business on April 29.

For questions contact DICE@inl.gov

View Video Proceedings

The DICE Digital Engineering Conference 2024 featured guest speakers from across the digital industry. This year we’ve added a playlist with featured presentations recorded during the Conference. Those can be viewed by clicking on the YouTube link below.

DICE Panel & Opening Keynote: Harlan Bowers

Day 1: Morning Breakout Sessions

Day 1: Afternoon Breakout Sessions

Day 1: Afternoon Keynote, Candace Ling.

Day 2: Morning Breakout Sessions

Mid-day Keynote: Geraldine Richmond

Day 2: Afternoon Breakout Sessions

Closing Keynote: Daniel Hettema

View/Download Presenter Slide Decks

The DICE Digital Engineering Conference 2024 featured session tracks and guest speakers from across the digital industry. The following presentation topics provide an opportunity to foster collaborations that will enhance our nation’s digital future. You can preview or download presentation topics of interest in the table below.

CONTACT INFORMATION